The rapid advancement of artificial intelligence (AI) is driving unprecedented demand for high-performance memory solutions.
SEOUL, Oct 21 (Reuters) - The global rush by chipmakers to produce AI chips is tightening supply of less glamorous chips used in smartphones, computers and servers, spurring panic buying by some ...
China's DRAM maker CXMT is reportedly developing compute express link (CXL) DRAM modules, a move that could escalate rivalry with Samsung Electronics and SK Hynix as the CXL market takes off in 2026.
Apple launched a slate of new iPhones on Tuesday loaded with the company's new A19 and A19 Pro chips. Along with an ultrathin iPhone Air and other redesigns, the new phones come with a less flashy ...
Abstract: Garbage collection (GC) is a critical memory management mechanism within the Java Virtual Machine (JVM) responsible for automating memory allocation and reclamation. Its performance affects ...
As SK hynix leads and Samsung lags, Micron positions itself as a strong contender in the high-bandwidth memory market for generative AI. Micron Technology (Nasdaq:MU) has started shipping samples of ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
There are lots of ways that we might build out the memory capacity and memory bandwidth of compute engines to drive AI and HPC workloads better than we have been able to do thus far. But, as we were ...
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