Semiconductor Engineering

3D Imaging Buried Interfaces In Twisted Oxide Moirés (Cornell, SLAC, Stanford et al.)

Imaging Buried Interfaces in Twisted Oxide Moirés” was published by researchers at Cornell University, SLAC National ...
EDN

Mastering multi-physics effects in 3D IC design

Stacking dies introduces layers of complexity driven by multi-physics interactions, which must be addressed at the start of ...

3D digital avatars are redefining human interaction. Here’s what it means for brands

3D digital avatars are changing the equation. With real-time animation tools and AI modeling, brands can create content that ...
IEEE

Energy-Efficient UAV-Assisted WSN: 3D Trajectory Design for Joint Positioning and Data Collection

Abstract: Unmanned aerial vehicles (UAVs), serving as aerial base stations (BSs), are able to provide not only the communication services for data collection from sensor nodes (SNs), but also the ...