Limiting the amount of RAM used by the TCP/IP stack in embedded systems improves the device’s security and reliability.

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Abstract: Hybrid bonding with 3D stacking of thin chips for high bandwidth memory is a widely explored packaging technology. In this study, thin memory wafer fabrication is demonstrated for multichip ...

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Abstract: One of the technical challenges in 2.5D SiP is thermal issue increase with higher performance. In this paper, mass reflow bonding with molded underfll process for chip to wafer stacking of ...