Siemens has entered into a strategic partnership with Xometry, the global, AI-native marketplace connecting buyers and suppliers of custom manufacturing. The partnership will allow Siemens to embed ...
On April 9, 2026, SiFive announced the completion of a $400 million oversubscribed Series G financing, and NVIDIA appeared on the list of investors. What's more notable is not the financing amount, ...
Silicon carbide (SiC) is best known as the wide-bandgap material driving high-efficiency power electronics that support the green transition. Yet its potential reaches beyond power electronics. SiC’s ...
Worldwide chip sales in March increase 79.2% year-to-year, 11.5% month-to-month ...
The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, today announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives. This ...
GlobalFoundries (Nasdaq: GFS) (GF) today announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO). GF’s SCALE solution, or Silicon photonics Co-packaged Advanced ...
Analysts are bullish on Main Market-bound SkyeChip Bhd ahead of its listing,highlighting its scalable silicon intellectual property (IP) licensing model and exposure to artificial intelligence ...
Apple is considering shifting part of its semiconductor foundry production away from Taiwan Semiconductor Manufacturing Co. to alternative suppliers including Samsung Electronics and Intel, according ...
Joint Innovation Laboratory strengthens charging validation, standards development, and global compliance for new energy vehicles ...
Across Europe’s semiconductor debate, the narrative is shifting from urgency to realism. In the following three articles, we examine how the European Union is recalibrating its chip strategy as ...
QuickLogic Corporation (NASDAQ: QUIK) will showcase its EOS™ S3 SoC and eFPGA solutions at Sensors Converge 2026, taking place at the Santa Clara Convention Center. Attendees can visit Booth 1039 to ...
As demand for high-performance AI chips rises, competition for 3nm and below fabrication capacity, along with advanced packaging technologies such as 2.5D and 3D integration, is becoming increasingly ...
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