Business Wire

Celestial AI Secures $250 Million Funding to Revolutionize AI Infrastructure with Its Photonic Fabric™

SANTA CLARA, Calif.--(BUSINESS WIRE)--Celestial AI™, creator of the Photonic Fabric™ optical interconnect technology platform, today announced that it has raised $250 million in its Series C1 funding ...

Kopin Announces Breakthrough MicroLED-Based Optical Interconnect Technology for AI Infrastructure in Collaboration with Fabric.AI

Kopin Corporation (NASDAQ: KOPN), a leading provider of application-specific optical systems and high-performance microdisplays, including MicroLED displays, today announced a strategic collaboration ...

Fabric.AI Announces Ticker Symbol Change to “FABC” as It Advances AI Infrastructure Strategy and MicroLED Interconnect Development

AI” or, the “Company”), an AI infrastructure company developing a suite of fabless semiconductor technologies for next generation “AI factories,” today announced that its common stock will begin ...
Morningstar

Keysight Expands 1.6T Interconnect Validation Technology to Include Passive Copper and Low Power Optics

Keysight Expands 1.6T Interconnect Validation Technology to Include Passive Copper and Low Power Optics Enhanced testing improves reliability and reduces risk when deploying the most demanding ...

Fabric.AI (Nasdaq: SBLX) Launches Breakthrough MicroLED Interconnect Technology as First Step in Building Next-Generation “AI Factory” Infrastructure. Partners with Leading ...

Introducing a new suite of fabless semiconductor technologies designed to power AI factories—smart data centers optimized for producing intelligence at scale; Initial focus on MicroLED optical ...
Business Wire

ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its ...
SiliconANGLE

Intel, Google and other tech giants team up to develop UALink AI chip interconnect

Eight of the tech industry’s largest players are teaming up to launch the UALink Promoter Group, a new artificial intelligence hardware initiative detailed today. The project focuses on developing an ...

Syenta raises $26M in funding to speed up chip interconnect production

Australian chip manufacturing startup Syenta Inc. today announced that it has raised $26 million in funding to expand its ...
EDN

Interconnect technology supports complex SMT automation

Anew interconnect technology, called Solderball Pin, from interconnect manufacturer Autosplice (San Diego, CA), enables automation of individually placed surface-mount pins on pc boards. Unlike ...
Nasdaq

Keysight Expands 1.6T Interconnect Validation Technology to Include Passive Copper and Low Power Optics

Enhanced testing improves reliability and reduces risk when deploying the most demanding critical-path interconnects in AI and high‑performance computing networks SANTA ROSA, Calif.--(BUSINESS WIRE)-- ...
Rutland Herald

Keysight Expands 1.6T Interconnect Validation Technology to Include Passive Copper and Low Power Optics

Keysight Technologies, Inc. (NYSE: KEYS) today introduces the next generation of its 1.6T Ethernet interconnect error-performance validation portfolio, expanding and enhancing its capabilities to ...