New series of multi-channel power management modules for smartphones and tablets is based on SESUB technology, featuring a power supply management IC chip that is embedded directly into the substrate.

Explore how vertical power delivery enhances efficiency by embedding components within PCBs and reducing power losses.

Addressing key challenges facing embedded-system designers — integrating of digital audio and improving power efficiency — the DPOxAUDIO and DPOxPWR modules are designed to automate key measurement ...

Wide range of congatec modules support for computationally powerful, energy-efficient embedded AI applications SAN DIEGO, CA, UNITED STATES, January 9, 2026 ...

The range of high-performance, power-efficient embedded computing modules has never been broader, making it more difficult for developers to find the best fit. Have embedded developers ever had such a ...

TOKYO--(BUSINESS WIRE)-- Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new structure for a silicon carbide metal-oxide-semiconductor field-effect transistor ...

The RN171 is a small form factor, ultra-low power embedded TCP/IP module measuring only 27 x 18 x 3.1 mm. The RN171 is a full-featured 802.11 b/g surface mount module. Due to its small form factor and ...

congatec launches COM Express Compact module based on the latest AMD Ryzen™ AI Embedded P100 processor series SAN DIEGO, CA, UNITED STATES, January 20, 2026 ...