As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the ...

The data connection device under test in Figure 1 is characterized by comparing test signals sent into the link with signals measured at the link output. The differences between these two test signals ...

As the number of higher-throughput applications grows, so does the need for a wider bandwidth and network coverage in wireless systems. Given limited spectrum allocation, wireless communication ...

Sometimes, you only want to analyze those signal components that meet certain criteria or occur at certain times within an acquisition. This is not too difficult for a single acquisition, but what if ...

A tough challenge for test engineers is explored in terms of test methods, pitfalls, and measurement errors. For the test engineer, RF and microwave power amplifier testing imposes unique challenges.