Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...
PITTSBURGH, Nov. 19, 2024 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced it is integrating the NVIDIA Modulus AI framework into Ansys semiconductor simulation products to deliver AI ...
The partnership aims to combine AI infrastructure, simulation, and industrial expertise to create AI-driven manufacturing and ...
Ansys delivers its semiconductor simulation solution, Ansys Power Library (APL), to the Arm Neoverse architecture to support development on Amazon Web Service’s (AWS) Graviton2 processors This ...
A new technical paper titled “Achieving Sustainability in the Semiconductor Industry: The Impact of Simulation and AI” was published by researchers at Lam Research. “Computational simulation has been ...
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency, and performance of ...
L&T Semiconductor Technologies is expected to outline a partner-led expansion into cellular IoT modules at CES, positioning ...
Integration of NVIDIA Modulus AI framework with the Ansys SeaScape platform will enable engineers to easily build customized AI solutions that can improve designer productivity and quickly identify ...
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