Enabling higher power within the same rack space, Microchip’s MCPF1525 power module delivers up to 25 A per device, stackable ...
AI servers are running out of power and space. A small module can solve both, helping systems run better in tight designs. Find out more!
Technology announces the launch of the MCPF1525 Power Module, a highly integrated device with a 16V Vin buck converter that ...
The increasing AI and high-performance computing workloads demand power solutions that combine efficiency, reliability and ...
A new ultra-compact, stackable power module design drastically raises current delivery limits while shrinking footprint for ...
Beyond data centers and high-density computing racks, the air-cooled thermal module is particularly suitable for AI and HPC servers, edge computing modules, distributed computing systems, electric ...
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